Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability (Paperback)

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Description


This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.



Product Details
ISBN: 9781489978011
ISBN-10: 1489978011
Publisher: Springer
Publication Date: October 1st, 2016
Pages: 253
Language: English